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                                                        —内置基带芯片UBX-G5000工艺解析

 

1.U-Blox Basedband IC Introduction

There are two series of U-Blox5 GPS Chip,a single chip UBX-G5010 with 8×8mm QFN-56 package,and a chipset module fully integrated with a baseband chip UBX-G5000 with 9×9mm Pin-100 ceramic BGA package,and a RF chip UBX-G0010 with 4×4mm QFN-24 package.

u blox5

U-blox 5 chips have been specifically designed for applications with tight cost, size and power constraints that require ultra-fast acquisition and high-precision tracking. Its highly integrated architecture brings full positioning functionality, from antenna input to position data output, in a self-contained solution that requires few external components. Moreover, innovative power hardware and software features enable the engine to operate on as little as 50 mW. This ensures long battery life times, a critical feature for portable applications.

U-blox5 chips compute positions instantly and accurately. A dedicated acqusition engine with over 1 million effective correlators is capable of massively parallel searches across the time/frequency space. This makes statellite acquisition possible in less than 1 second while long integration times enable a -160 dBm acquisition sensitivity. Acquired satellite are then passed on to a power-optimized tracking engine. This setup allows for the GPS engine to simutaneously track up to 16 satellites and search for new ones.

The on-chip Power Management Unit (PMU) enables a single supply voltage source and features a switch-mode DC/DC converter that optimizes power efficiency and extends the supply voltage range. All required core and I/O voltages are generated internally by means of LDOs(Low-Drop-Out)

 When Galileo-L1 signals become available, u-blox5 receiver will be capable of receiving and processing them via a simple upgrade. The ability to receive and track Galileo satellite signals will result in higher coverage, improved reliability and better accuracy. The chip's advanced jamming suppression mechanism automatically filters signals from interfering sources, thus maintaing high GPS performance.

The u-blox5 single chip consists of two ICs assembled into a single package, often referred to as "Sip" or "System in Package". This enables the independent selection of the optimal technology for the RF-IC and for the baseband-IC. The RF-IC is diffused on 0.18 µm RF-CMOS technology while the baseband-IC is on 0.13 µm CMOS. Alternatively, the two ICs can be assembled into two separate packages. This chipset solution provides  an external bus interface to connect an external memory.

 

UBX G5000 Baseband IC

Dual Chip GPS/Galileo Receiver: Block Diagram

 

functional table

2.Package Analysis

2.1 Package Apperance

package copy

2.2 Pad Features And SIzes

pad size 2 copy

2.3 Package Information

package2

2.4 X-Ray Image

dieDie2

Tilt 90°

90du2

 

2.5 X-Section Image Of BGA Substrate

BGA Substrate

2.6 Pad And Wire Dimension

pad and wire dimension

2.7 EDS Analysis For Bonding Wire

ESD Analysis

3.UBX-G5000 Controlled Chip Analysis

3.1 Top Layer OM Image: On Top Die

Top Layer OM Image

3.2  FIB Cross Section Image On Seal Ring

FIB

3.3 Cross Section Line Define On Top Layer

Top layer Line Define

3.4 Chip Profile(Chip Process=1P6M)

chip pro1 copy copy

profile copy

4.UBX-G5000 Baseband Chip Analysis

4.1 Metal Layer

Metal Layer copy

4.2 Cross Section Line Define

cross section line define

4.2.1 Position1 Profile On M1 Layer

position1 copy

M1 Profile

M1 pro copy

▼CNT Profile

CNT Pro copy

▼CNT&Poly Profile

CNTPOLY copy

4.2.2 Position2 Profile On M1 Layer

position2 copy

▼CNT Profile

CNT Position2 copy

▼Poly Profile

Poly position2 copy

5.Module Analysis And Memory Structure Analysis

5.1 Function Module Ratio

block copy

1

5.2 Memory Module Analysis

memory type

▼存储容量表(Memory Capacity Table)

2

5.3 SEM Image

SRAM copy

5.4 “ROM”SEM Image:On M1

ROM

▼分析总结表(Analysis Summarize Table)

3