—内置基带芯片UBX-G5000工艺解析
1.U-Blox Basedband IC Introduction
There are two series of U-Blox5 GPS Chip,a single chip UBX-G5010 with 8×8mm QFN-56 package,and a chipset module fully integrated with a baseband chip UBX-G5000 with 9×9mm Pin-100 ceramic BGA package,and a RF chip UBX-G0010 with 4×4mm QFN-24 package.
U-blox 5 chips have been specifically designed for applications with tight cost, size and power constraints that require ultra-fast acquisition and high-precision tracking. Its highly integrated architecture brings full positioning functionality, from antenna input to position data output, in a self-contained solution that requires few external components. Moreover, innovative power hardware and software features enable the engine to operate on as little as 50 mW. This ensures long battery life times, a critical feature for portable applications.
U-blox5 chips compute positions instantly and accurately. A dedicated acqusition engine with over 1 million effective correlators is capable of massively parallel searches across the time/frequency space. This makes statellite acquisition possible in less than 1 second while long integration times enable a -160 dBm acquisition sensitivity. Acquired satellite are then passed on to a power-optimized tracking engine. This setup allows for the GPS engine to simutaneously track up to 16 satellites and search for new ones.
The on-chip Power Management Unit (PMU) enables a single supply voltage source and features a switch-mode DC/DC converter that optimizes power efficiency and extends the supply voltage range. All required core and I/O voltages are generated internally by means of LDOs(Low-Drop-Out)
When Galileo-L1 signals become available, u-blox5 receiver will be capable of receiving and processing them via a simple upgrade. The ability to receive and track Galileo satellite signals will result in higher coverage, improved reliability and better accuracy. The chip's advanced jamming suppression mechanism automatically filters signals from interfering sources, thus maintaing high GPS performance.
The u-blox5 single chip consists of two ICs assembled into a single package, often referred to as "Sip" or "System in Package". This enables the independent selection of the optimal technology for the RF-IC and for the baseband-IC. The RF-IC is diffused on 0.18 µm RF-CMOS technology while the baseband-IC is on 0.13 µm CMOS. Alternatively, the two ICs can be assembled into two separate packages. This chipset solution provides an external bus interface to connect an external memory.
Dual Chip GPS/Galileo Receiver: Block Diagram
2.Package Analysis
2.1 Package Apperance
2.2 Pad Features And SIzes
2.3 Package Information
2.4 X-Ray Image
▼Tilt 90°
2.5 X-Section Image Of BGA Substrate
2.6 Pad And Wire Dimension
2.7 EDS Analysis For Bonding Wire
3.UBX-G5000 Controlled Chip Analysis
3.1 Top Layer OM Image: On Top Die
3.2 FIB Cross Section Image On Seal Ring
3.3 Cross Section Line Define On Top Layer
3.4 Chip Profile(Chip Process=1P6M)
4.UBX-G5000 Baseband Chip Analysis
4.1 Metal Layer
4.2 Cross Section Line Define
4.2.1 Position1 Profile On M1 Layer
▼M1 Profile
▼CNT Profile
▼CNT&Poly Profile
4.2.2 Position2 Profile On M1 Layer
▼CNT Profile
▼Poly Profile
5.Module Analysis And Memory Structure Analysis
5.1 Function Module Ratio
5.2 Memory Module Analysis
▼存储容量表(Memory Capacity Table)
5.3 SEM Image
5.4 “ROM”SEM Image:On M1
▼分析总结表(Analysis Summarize Table)