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With the deepening applications of augmented reality (AR) in virtual-physical fusion, virtual reality (VR) in immersive interaction, and wearable devices in precise sensing, unprecedented stringent requirements have been placed on the accuracy, power consumption, and intelligence of motion sensors. As a flagship product of TDK's InvenSense SmartMotion™ series, the ICM-45686 redefines the performance boundaries of 6-axis MEMS inertial measurement units (IMUs) through innovative technology.

The technical foundation of the ICM-45686 lies in the perfect balance of precision, power consumption, and environmental adaptability. Next, we will introduce how this chip translates this balance into tangible performance advantages through hardware architecture innovation, intelligent algorithm optimization, and multi-scenario adaptive design.

 

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01 Chip Overview

 

The ICM-45686 is a high-performance 6-axis MEMS motion sensor that integrates a 3-axis gyroscope and a 3-axis accelerometer as its core components. Equipped with innovative BalancedGyro™ technology, it delivers high-precision motion measurement while maintaining ultra-low power consumption. The built-in APEX module supports basic scenarios such as pedometer, tilt detection, single/double-click detection, motion wake-up, and fall detection, as well as advanced functions like gesture recognition and audio spatial perception.

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Chip Introduction (Image Source: Chip Manual)

 


The chip is widely compatible with various application scenarios such as AR/VR headsets, wearable devices, high-precision robots, gaming controllers, and drone flight control systems, providing stable and reliable motion sensing capabilities for devices.

 

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Wearable devices, robotics industry, drone flight control (Image source: internet)

 

The figure below shows the top-level schematic of the chip, allowing for a more comprehensive and intuitive understanding of this chip.

 

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Top-Level Schematic of ICM-45686

 


02 Core Features

ICM-45686 redefines the performance boundaries of consumer-grade sensors through breakthroughs in the following core technologies.

The Innovative Application of BalancedGyro™ Balanced Gyroscope Technology – As the world's first MEMS architecture, it achieves exceptional vibration suppression and temperature stability at the hardware level, reducing gyroscope drift caused by environmental fluctuations to an negligible level. This unprecedented enhancement is unmatched in consumer-grade gyroscopes. For applications such as AR/VR devices that are highly sensitive to motion sensing, this stability directly determines the synchronization accuracy between virtual visuals and real-world movement.

 

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ICM-45686 Top-Level MEMS Device

 

Breakthrough in Low-Power Intelligent Design – The high demand for battery life in consumer devices forces sensors to strike a balance between high performance and low power consumption. The ICM-45686 boasts a rated current of only 220μA in 6-axis mode, combined with an ultra-low-power accelerometer wake-up mode, enabling energy savings while maintaining continuous sensing. Compared to competing products, it significantly extends gyroscope operation time, perfectly meeting the needs of portable scenarios such as wearables and TWS earphones.


The Precision Leap Enabled by On-Chip Self-Calibration Technology—Traditional MEMS sensors are prone to performance degradation due to device aging over their lifecycle. The ICM-45686, however, employs an integrated temperature sensor and automatic calibration algorithm to achieve on-chip sensitivity correction, significantly enhancing gyroscope accuracy. This breakthrough particularly addresses the compensation challenges of hand tremors in applications like Optical Image Stabilization (OIS), while also eliminating the need for complex factory calibration processes, resulting in substantial production cost reductions.

 

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ICM-45686 BLOCK DIAGRAM (Image Source: Chip Manual)

 


Interface compatibility and environmental robustness are also crucial components of technical capabilities—the ICM-45686 supports various communication interfaces such as I²C, I3C, and SPI, and features a compact 2.5mm×3mm×0.81mm package for flexible integration across diverse device platforms. With a gyroscope full-scale range of ±4000dps and an accelerometer full-scale range of ±32g, it ensures measurement reliability in extreme motion scenarios. The accumulation of these technical details forms the core foundation of the 6-axis MEMS motion sensor chip's ability to empower industries across all sectors.

 

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ICM-45686 Packaging Diagram

 


03 Chip Appreciation

 

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ICM-45686 MEMS Oscillator Comb Structure

 

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ICM-45686 ESD device

 

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ICM-45686 Transistor

 

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ICM-45686 Comb-Finger Capacitive Sensor

 

This concludes today's sharing. If you require more detailed technical information or have any inquiries related to collaboration, please feel free to contact us. We will be delighted to provide you with professional answers and technical support.

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