On July 11-12, the 5th China Integrated Circuit Design Innovation Conference and IC Application Ecology Exhibition (ICDIA) was successfully held at the Jinji Lake International Convention Center in Suzhou. This year's ICDIA chip exhibition adopts the "1+1+4+1" mode, creating one summit forum, one AI developer theme conference, four sub forums, and one IC application ecosystem exhibition. The four exhibition areas of the IC Application Ecology Exhibition focus on showcasing China's IC innovation achievements, cutting-edge AI technologies and robots, and intelligent ecological application scenarios.
As a leading integrated circuit competitiveness analysis service provider in China, Xinlian Cheng was invited to participate in the exhibition and fully demonstrated the latest technology service cases such as circuit analysis and IC design services to the on-site audience.
Camera switching allows you to immerse yourself in revisiting the exciting scene of the exhibition.
In today's rapidly developing technologies such as artificial intelligence, the Internet of Things, and 5G, the application scenarios of chips continue to expand, and the integration and complexity continue to increase. Xinlian Cheng's independently developed EDA tool BunnyGS ® The system has attracted a lot of attention with its innovative technological architecture and powerful features. This system integrates cutting-edge technologies such as image processing, AI algorithms, and cloud computing, with highly integrated subsystems including layout and schematic editing, digital circuit signal flow analysis, and automatic layout and routing. With powerful circuit analysis and processing capabilities, it can meet customers' analysis needs for ultra large scale IC projects and provide customizable integrated circuit analysis solutions.
At the Chuangxin Exhibition, the Xinlian Cheng booth attracted numerous industry visitors to stop and exchange ideas with its innovative technological achievements and professional industry solutions. The professional team of Xinlian Cheng, with a rigorous attitude and profound industry accumulation, provided detailed technical cases and service content to visiting customers, and conducted in-depth analysis and comprehensive interpretation of industry pain points.
Since its establishment in 2016, Xinlian Cheng has completed over 4000 chip competitiveness analysis projects, including RF SoC chips for 5G communication applications, MCU series chips, various high-speed and low-speed ADC/DAC chips, various sensor application chips, power management chips, high-speed clock series chips, driver application chips, interface and isolation chips, DRAM/NAND storage series and other application chips in various market fields. A single project can analyze circuit scales up to tens of millions of gates, and the minimum process can reach 5nm. Through a series of IC design services such as patent comparison analysis, patent infringement analysis, and patent authorization feasibility analysis, Xinlian Cheng helps technology enterprises successfully achieve patent protection and infringement avoidance, and assists many IC design enterprises in steady growth.
During the exhibition, the Xinlian Cheng team had in-depth discussions with numerous experts and industry leaders in the field of integrated circuits, focusing on topics such as semiconductor technology innovation, market opportunities, and industrial upgrading. The lively on-site interaction and communication have created new opportunities for the coordinated development of industries.
The two-day Chuangxin Exhibition came to a successful conclusion. In the future, Xinlian Cheng will continue to improve its technology resource library and optimize its EDA toolchain solutions, committed to providing industry customers with more efficient technical support and higher quality innovative services. We look forward to working together with more industry partners to promote the innovative development of China's integrated circuit industry.
If you need professional technical support, you can contact us through the following methods.
