On November 20-21, the Chengdu Chongqing Integrated Circuit 2025 Development Forum and the 31st Integrated Circuit Design Industry Exhibition (ICCAD-Expo 2025) with the theme of "Open Chip Creation, Achieving the Future" were successfully held at the Chengdu Western China International Expo City.
As a leading supplier of integrated circuit design information, Silintech showcased its latest technology cases at this conference. At the "EDA and IC Design Services" special forum, Feng Qi, Director of Xinlian Cheng's Circuit Engineering Department, gave a wonderful speech entitled "Performance Transition and Architecture Innovation of Battery Management Simulation Front end Chips: In Depth Iterative Analysis from LTC6811 to ADBMS6834", providing assistance for accelerating the localization of chips.
一、 BMS AFE chip technology iterative logic
The BMS AFE (Battery Management System Analog Front End) chip is the core sensing and data processing unit in various battery application scenarios such as electric vehicles, energy storage systems, and portable devices. It undertakes key functions such as battery status monitoring, data conversion, and safety protection warning, directly determining the safety, reliability, and endurance performance of the battery system.
As the safety core of electric vehicles and energy storage systems, BMS AFE chips are directly connected to each energy-saving cell, possessing multi-dimensional sensing capabilities like "eyes", "ears", and "skin" - real-time monitoring of cell voltage, accurate measurement of total charge and discharge current, comprehensive perception of battery temperature, and precise capture of key physical state information of cells; It is located between the battery cell and the main control unit, serving as the sole source of battery data. Through data acquisition conversion and high-speed communication links, it achieves stable data upload to the main controller.
二、 Professional analysis of Xinlian's in-depth iteration from LTC6811 to ADBMS6834
At the "EDA and IC Design Services" special forum held on November 21st, Feng Qi, Director of the Circuit Engineering Department of Silintech, deeply analyzed the technical iteration logic of LTC6811, LTC6813, and the ADBMS6815, ADBMS6830, ADBMS6832, and ADBMS6834 series chips from a professional perspective, presenting a wonderful sharing for the guests present.
Through in-depth analysis of the circuit principles and processes of a series of battery management and monitoring chips from ADI, the chip connection forms an innovative path for analyzing the core architecture, providing precise support for the performance and safety requirements of high-end applications.
For more information, Please click here to download the report：《Technological Evolution and Architectural Innovation for BMS AFE Chips: In-depth Analysis of the Iteration from LTC6811 to ADBMS6834》
At the forum, Mr. Feng Qi, Director of the Circuit Engineering Department of Xinlian Cheng, provided innovative ideas and diverse perspectives for industry colleagues present through his easy to understand sharing. He stated that AI technology has become the core driving force for industrial development, and the wave of technological iteration is sweeping the industry at an unprecedented speed. Only by actively seizing development opportunities and accurately anchoring core directions can we keep up with the global leading trend, promote the coordinated growth and win-win development of the upstream and downstream of the industrial chain.
In the current era of comprehensive penetration of 5G, AI, and IoT technologies, the dual increase in chip integration and application complexity has brought higher challenges to EDA tools. BunnyGS independently developed by Silintech ® The system, with its innovative technological architecture and powerful functions, has become the focus of the scene - integrating image processing, artificial intelligence algorithms, and cloud computing technology. It has complete core functional modules such as layout and schematic editing, digital circuit signal flow analysis, and automatic layout and routing. Its super strong circuit analysis and processing capabilities can not only accurately match the complex requirements of ultra large scale IC projects, but also provide customized integrated circuit analysis solutions, injecting technological power into chip design innovation.
At the conference, the Silintech team, with their profound industry experience and rigorous technical attitude, introduced the technical cases and service content of Xinlian Cheng to numerous industry audiences, and conducted in-depth analysis and interpretation of the pain points and difficulties in integrated circuit design.
Since its establishment in 2016, Silintech has become a trusted professional IC design information supplier for more than 1200 IC design companies, with over 6000 circuit analysis reports covering various high-speed and low-speed ADC/DAC chips, RF chips, interface chips, power management chips, various sensor application chips, high-speed clock series chips, driver application chips, interface and isolation chips, RF SoC chips for 5G communication applications, MCU series chips, DRAM/NAND storage series and other application chips in various market fields. With highly accurate and readable circuit analysis reports, Silintech helps design companies quickly build new design applications, solve and optimize design problems, and accelerate product launch!
In addition to accurately meeting customer needs, the conference is also a platform for ideological collision. The Silintech team gathered with experts, scholars, and industry leaders in the field of integrated circuits to engage in in-depth discussions and experience sharing on core topics such as semiconductor technology innovation trends, market opportunities, and industrial upgrading paths. They built a solid bridge for industrial collaborative development and explored new possibilities for cooperation.
The two-day ICCAD Expo event has come to a successful conclusion, but Silintech's push for industrial innovation has never stopped. In the future, we will continue to expand our technology resource library and provide high-precision and easy to understand circuit analysis reports to help enterprises quickly overcome design difficulties and seize market opportunities; At the same time, we will iteratively upgrade our EDA toolchain solution, empower semiconductor industry customers in all aspects with more efficient technical support and high-quality innovative services, and jointly promote high-quality development of the industry.
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